A 12-inch wafer fab needed annual ISO Class 3 requalification of its lithography bay to safeguard DUV advanced-node yield baselines. SYE completed full-zone particle, ULPA, airborne microbial and ESD verification inside the scheduled shutdown window.
The photo bay allowed only a 48-hour downtime window requiring three particle counters running in parallel. With several hundred ULPA filters to scan, traditional single-point sweeping was too slow — a grid-based automated scan strategy was required.
ISO 14644-1 / IEST RP-CC006 at-rest particle counts and ISO 14644-3 ULPA integrity tests
0.1 µm particle counter on automated scan fixtures, improving throughput by ~40%
Airborne microbial sampling via dual-path (settling + impaction) to align CFU readings with process trends
Delivered full IEST-format report covering FFU performance, ESD and continuous temperature/humidity traces
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